LCD module surface mount technology (LCM SMT technology)

SMT placement equipment used to process mount components (chips, resistors, capacitors, etc.) attached to the corresponding pad locations printed solder paste on the PCB, and through reflow equipment and components on the PCB to achieve a weld processing methods. Is a more traditional installation.
Process: printing, patch, reflow, cleaning, testing
Advantages: high reliability, SMT process due to mount components (especially the chips) Size (package size), the number of chip pins affect the accuracy of space and equipment, which is suitable for larger PCB board processing, easy maintenance .
Disadvantages: bulky, high cost, miniaturization limit LCM. Because of its joints are exposed, vulnerable to damage.
Trends: Considering the cost and volume of the products, IC manufacturers are reduced (SMT a) encapsulation yield QFP, therefore, the conventional SMT system is gradually replaced in future products.

LCD module board for Chip Technology (LCM COB Technology)

COB chip technology that is bonding (Bonding) in the PCB. The bare chip with a sticky piece of plastic attached directly to a specified location on the PCB by soldering machine with aluminum PCB board with the corresponding chip electrode pads connected, then vinyl and aluminum seal curing the chip, enabling the chip mechanical electrical connection between the circuit board and the electrode.
Process: sticky film, curing, bonding, testing, plastic closures, curing and testing.
Advantages: COB process has loaded, packaging, packing density, reliability, etc., and compared with standard SMT processes to reduce manufacturing costs.
Disadvantages: COB process using a small bare chip, high precision equipment for processing large number of lines, the gap smaller, smaller PCB board space requirements, the chip seal weld pressure cured with vinyl protection to joints and welding line is not subject to external damage, high reliability, but the damage can not be repaired, only to be scrapped.

LCD module tape automated bonding technology (LCM TAB technology)

Is a multi-pin LSI device (IC) chip (Chip), is no longer the traditional first encapsulated into a complete individual, in favor of TAB carrier, not directly to the chip seal surface-mount board. inside and outside that mining "polyimide" (Polyimide) of the soft roll, and the accompanying erosion into the pin as a foil carrier, so that the first large-scale chip combination "within the pin" on. was then to automatically test "outer pin" on the circuit board are combined and assembled. this will be one of the new packaging and assembly packaging method, known as TAB method.
Processes: ACF preload on parity, the main pressure testing.

LCD module chip is directly in the glass bonding process (LCM COG technology)

In a small area of the outer lead concentrate will be designed LCD LCD dedicated LSI-IC dedicated chip stuck in the meantime, each endpoint using bonding wires welded together as required, and then drop by drop casting on top to seal glue, and IC the input end is also designed to lead in the LCD glass outside and bonding to the same input terminal of the chip, at this point, with chips constitute a complete LCD has an LCD module. Usually leads to the interface with the FPC or conductive paper connections and allow customers to use.
Step: put the screen, put the ACF, put the chip, parity, chip bonding, plastic closures, testing.
Pros: greatly reduce the size of the entire LCD module, and easy mass production for consumer electronics products with the LCD, such as: mobile phone, PDA, MP3 and other portable electronic products. Under IC manufacturers to promote, COG will be the main connection in the future IC and LCD.

COF LCD module technology (LCM COF technology)

Chip On Film That chip is directly mounted on the flexible PCB, then this soft anisotropic conductive adhesive transfer film with liquid crystal display device is connected to the outer lead at. . A high degree of integration of this connection, the peripheral components can be mounted on the flexible PCB with IC. Will be fixed on the flexible circuit board IC grain soft film packaging technology, is the use of an additional circuit board for a soft chip carrier package of technology and flexible substrates circuit chip bonding.
Processes: the pin binding, plastic closures, testing.
Advantages: High density / high pin count (High Density / High Pin Count), fine (Fine Pitch), group bonding (Gang Bond), high output (High Throughput) and high reliability (High Reliability) characteristics. In addition, it has a short, light, flexible (Flexible) and roll-to-roll (Reel to Reel) production characteristics.

LCM common backlight technology

Liquid crystal display device is a passive type display device, which itself does not light, the light is achieved by modulating the external display. Just outside the liquid crystal display device to display a prerequisite. Therefore, the liquid crystal display assembly, in use, light clever solution may improve the quality assurance and the LCD, the LCD lighting mode generally divided into natural light and external light lighting mode setting mode. The outer light settings, and points backlight, front projection light sources and categories.